American researchers have developed 3D printing technology that makes complex curved microcircuits possible.
Nowadays, when creating chips, vertical etching of channels in a substrate is used for through metallization. Scientists have found a way to print substrates with ready-made holes for metallization. This allows you to route at different angles and directions to make the layout tighter.
Researchers have already managed to print such a substrate with curved channels for metallization. The inner diameter of the latter was 10 µm. This was enough to connect the image sensor to the processor for processing.
“We are developing this technology to improve the three-dimensional integration of microelectronic subsystems such as infrared cameras and radar receivers,” explained one of the experts.
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